RecordNumber
2620
Author
Pang, John Hock Lye
Title
Lead free solder mechanics and reliability
Author Statement
John Hock Lye Pang
Publication
Springer
Publication Year
c2012
Collation
x, 175 p. ill. 24 cm
Notes
Includes bibliographical references and index
Subject
Solder and soldering. , Lead-free electronics manufacturing processes. , Green electronics.
Link To Document :
https://digitallib.qut.ac.ir/dL/search/default.aspx?Term=2620&Field=0&DTC=5
All Rights Reserved To Payam Mashregh Company
